Simulation between Soldering and Brazing of Copper at 450 Temperature by Zn-Sn Fillet Alloy

Soldering and brazing of copper and copper alloys

Low-Temperature Interface Reaction between Titanium and the Eutectic Silver-Copper Brazing Alloy

Reaction zones formed at 790 °C between solid titanium and liquid Ag-Cu eutectic alloys (pure and Ti-saturated) have been characterized. When pure Ag-Cu eutectic alloy with 40 at.% Cu is used, the interface reaction layer sequence is: αTi / Ti2Cu / TiCu / Ti3Cu4 / TiCu4 / L. Because of the fast dissolution rate of Ti in the alloy, the reaction zone remains very thin (3-6 μm) whatever the reacti...

Brazing & Soldering Today

Brazed components play an essential role in consistent joining techniques. The brazing process is characterized by low process temperatures and fast processing times, compared to welding techniques. Beside the resulting low manufacturing costs, brazing can join dissimilar materials, e.g. metals and ceramics. Consequently, brazing provides potential for many industrial applications like the prod...

Brazing & Soldering Today

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...

Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

The microstructure of Sn–8Zn–3Bi alloy was refined by increasing the solidification rate and the correlation between Zn-rich phase and the corrosion/oxidation behavior of the alloy was investigated. The Zn-rich phase transforms from coarse flakes to fine needles dispersed in the β-Sn matrix with the increase of the cooling rate. The transformation of Zn-rich precipitates enhances the anticorros...